Inventor · disambiguated record
Yaobin Feng
Also filed as: FENG YAOBIN
10 granted patents·1 pending application·15 citations·filing 2018–2025
83Inventor score
Files withYANGTZE MEMORY TECH CO LTD11
Top patents by PatentIndex Score
11 records- 0195US11903195B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Feb 13, 2024·2 cites·19 claims
- 0293US10804283B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Oct 13, 2020·8 cites·6 claims
- 0390US11574919B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·17 claims
- 0483US12356616B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0583US2025294742A1Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0682US10727056B2Method and structure for cutting dense line patterns using self-aligned double patterningYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jul 28, 2020·3 cites·8 claims
- 0768US12347684B2Method and structure for cutting dense line patterns using self-aligned double patterningYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0861US11378525B2Systems and methods for evaluating critical dimensions based on diffraction-based overlay metrologyYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 5, 2022·0 cites·13 claims
- 0960US11251043B2Method and structure for cutting dense line patterns using self-aligned double patterningYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1056US11162907B2Systems and methods for evaluating critical dimensions based on diffraction-based overlay metrologyYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 1139US10811363B2Marks for locating patterns in semiconductor fabricationYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →