Inventor · disambiguated record
Yasuhiro Fukaura
Also filed as: FUKAURA YASUHIRO
3 granted patents·1 pending application·16 citations·filing 1999–2003
67Inventor score
Files withTOSHIBA KK4
Top patents by PatentIndex Score
4 records- 0154US6613645B2Method of manufacturing semiconductor device with glue layer in openingTOSHIBA KK·Filed 2002·Granted Sep 2, 2003·8 cites·11 claims
- 0241US6965155B2Semiconductor device with glue layer in openingTOSHIBA KK·Filed 2003·Granted Nov 15, 2005·2 cites·26 claims
- 0340US2003102530A1Semiconductor wafer, method of manufacturing the same and semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
- 0438US6525402B1Semiconductor wafer, method of manufacturing the same and semiconductor deviceTOSHIBA KK·Filed 1999·Granted Feb 25, 2003·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →