Inventor · disambiguated record
Yasuhito Funada
Also filed as: FUNADA YASUHITO
21 granted patents·2 pending applications·312 citations·filing 1995–2009
95Inventor score
Top patents by PatentIndex Score
23 records- 0193US7182606B2Wired circuit boardNITTO DENKO CORP·Filed 2006·Granted Feb 27, 2007·25 cites·5 claims
- 0290US6100582ACircuit substrate, circuit-formed suspension substrate, and production method thereofNITTO DENKO CORP·Filed 1998·Granted Aug 8, 2000·56 cites·10 claims
- 0385US6096482ACircuit substrate, circuit-formed suspension substrate, and production method thereofNITTO DENKO CORP·Filed 1998·Granted Aug 1, 2000·54 cites·6 claims
- 0485US5578249AProcess for producing electrically conductive organic polymer compositionNITTO DENKO CORP·Filed 1995·Granted Nov 26, 1996·46 cites·7 claims
- 0584US5858518ACircuit substrate, circuit-formed suspension substrate, and production method thereofNITTO DENKO CORP·Filed 1997·Granted Jan 12, 1999·52 cites·22 claims
- 0683US7307853B2Wired circuit board assemblyNITTO DENKO CORP·Filed 2006·Granted Dec 11, 2007·11 cites·8 claims
- 0780US8134080B2Wired circuit boardISHII JUN·Filed 2006·Granted Mar 13, 2012·9 cites·5 claims
- 0875US7336446B2Suspension board having a circuit and a flying lead portionNITTO DENKO CORP·Filed 2004·Granted Feb 26, 2008·21 cites·4 claims
- 0973US7525764B2Suspension board with circuitNITTO DENKO CORP·Filed 2005·Granted Apr 28, 2009·5 cites·18 claims
- 1069US7638873B2Wired circuit boardNITTO DENKO CORP·Filed 2006·Granted Dec 29, 2009·3 cites·2 claims
- 1164US7531753B2Suspension board with circuitNITTO DENKO CORP·Filed 2005·Granted May 12, 2009·2 cites·7 claims
- 1263US7471519B2Wired circuit boardNITTO DENKO CORP·Filed 2005·Granted Dec 30, 2008·2 cites·3 claims
- 1360US7566833B2Wired circuit board and production method thereofNITTO DENKO CORP·Filed 2006·Granted Jul 28, 2009·2 cites·2 claims
- 1456US8071886B2Wired circuit board having a semiconductive grounding layer and producing method thereofISHII JUN·Filed 2007·Granted Dec 6, 2011·1 cites·7 claims
- 1556US7084493B2Wiring circuit board and production method thereofNITTO DENKO CORP·Filed 2004·Granted Aug 1, 2006·5 cites·11 claims
- 1656US2009142478A1Wired circuit board and producing method thereofNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1754US7501581B2Wired circuit board and producing method thereofNITTO DENKO CORP·Filed 2006·Granted Mar 10, 2009·0 cites·4 claims
- 1850US7008752B2Photosensitive resin composition and use of the sameNITTO DENKO CORP·Filed 2005·Granted Mar 7, 2006·0 cites·3 claims
- 1949US7586046B2Wired circuit boardNITTO DENKO CORP·Filed 2006·Granted Sep 8, 2009·0 cites·2 claims
- 2044US2005186332A1Production method of suspension board with circuitNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 2142US6117616ACircuit-forming substrate and circuit substrateNITTO DENKO CORP·Filed 1996·Granted Sep 12, 2000·7 cites·11 claims
- 2237US6245432B1Circuit substrate, circuit-formed suspension substrate, and production methods thereforNITTO DENKO CORP·Filed 1998·Granted Jun 12, 2001·7 cites·11 claims
- 2336US6333139B1Circuit-forming substrate and circuit substrateNITTO DENKO CORP·Filed 1999·Granted Dec 25, 2001·4 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Yasuhito Funada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →