Inventor · disambiguated record
Yaping Ge
Also filed as: GE YAPING
3 granted patents·2 citations·filing 2017–2017
51Inventor score
Top patents by PatentIndex Score
3 records- 0166US10942458B2Exposure system, exposure device and exposure methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Mar 9, 2021·1 cites·21 claims
- 0265US10748800B2Chip bonding apparatus and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD·Filed 2017·Granted Aug 18, 2020·1 cites·17 claims
- 0332US10903105B2Flip chip bonding device and bonding methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →