Inventor · disambiguated record
Yang Hong Heng
Also filed as: HENG YANG · HENG YANG HONG
5 granted patents·6 pending applications·12 citations·filing 2005–2024
72Inventor score
Files withINFINEON TECHNOLOGIES AG5GEELY HOLDING GROUP CO LTD3INFINEON TECHNOLOGIES1LIM FONG1STMICROELECTRONICS SDN BHD1
Top patents by PatentIndex Score
11 records- 0170US7923827B2Semiconductor module for a switched-mode power supply and method for its assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 12, 2011·6 cites·23 claims
- 0263US2024369373A1Method for generating high-precision road map, high-precision road map generation device, equipment and storage mediumGEELY HOLDING GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0362US2024369374A1Method, apparatus, and device for generating road data evaluation report, and storage mediumGEELY HOLDING GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0458US2024169743A1Vehicle positioning method and device based on environment matching, vehicle and storage mediumGEELY HOLDING GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0557US7674657B2Method of manufacture of encapsulated packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 9, 2010·2 cites·15 claims
- 0655US8030742B2Electronic device having profiled elements extending from planar surfacesINFINEON TECHNOLOGIES·Filed 2007·Granted Oct 4, 2011·2 cites·18 claims
- 0754US7795712B2Lead frame with non-conductive connective barINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 14, 2010·1 cites·18 claims
- 0844US2022157681A1Integrated circuit package with v-shaped notch creepage structureSTMICROELECTRONICS SDN BHD·Filed 2021·Application pending·0 cites
- 0943US8482119B2Semiconductor chip assemblyLIM FONG·Filed 2008·Granted Jul 9, 2013·1 cites·18 claims
- 1041US2010193920A1Semiconductor device, leadframe and method of encapsulatingINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
- 1135US2008308952A1Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing ApparatusINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →