Inventor · disambiguated record
Yasunori Hoshino
Also filed as: HOSHINO YASUNORI
11 granted patents·7 pending applications·2 citations·filing 2014–2022
78Inventor score
Files withPANASONIC IP MAN CO LTD18
Top patents by PatentIndex Score
18 records- 0184US11866536B2Copper-clad laminate plate, resin-attached copper foil, and circuit board using samePANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 9, 2024·2 cites·12 claims
- 0265US2025109233A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0364US11242425B2Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring platePANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·25 claims
- 0462US11958951B2Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·19 claims
- 0562US2023272213A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0660US2023257578A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0757US12022611B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 25, 2024·0 cites·10 claims
- 0857US11401393B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Aug 2, 2022·0 cites·7 claims
- 0956US12024590B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·17 claims
- 1056US2022389189A1Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1153US11820105B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Nov 21, 2023·0 cites·6 claims
- 1251US12233621B2Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foilPANASONIC IP MAN CO LTD·Filed 2020·Granted Feb 25, 2025·0 cites·12 claims
- 1351US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 1449US2016017141A1Resin composition for printed wiring board, prepreg and metal-clad laminatePANASONIC IP MAN CO LTD·Filed 2014·Application pending·0 cites
- 1543US2022289969A1Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1640US10472478B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Nov 12, 2019·0 cites·5 claims
- 1740US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 1830US11647583B2Prepreg, metal-clad laminated board, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted May 9, 2023·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →