Inventor · disambiguated record
Ya-Lin Hsiao
Also filed as: HSIAO YA-LIN
4 granted patents·1 pending application·20 citations·filing 2010–2018
69Inventor score
Top patents by PatentIndex Score
5 records- 0191US9625215B2Electronic device and heat dissipation plateHTC CORP·Filed 2015·Granted Apr 18, 2017·13 cites·11 claims
- 0281US9939858B2Electronic deviceHTC CORP·Filed 2015·Granted Apr 10, 2018·4 cites·13 claims
- 0377US9965003B2Electronic assembly and electronic deviceHTC CORP·Filed 2015·Granted May 8, 2018·3 cites·18 claims
- 0439US11039549B2Heat transferring moduleHTC CORP·Filed 2018·Granted Jun 15, 2021·0 cites·7 claims
- 0539US2010296946A1Pressure sensing device for electronic device and pressure sensing method and thermal dissipation device thereofCHEN MING-CHIH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →