Inventor · disambiguated record
Ya-Jui Hsieh
Also filed as: HSIEH YA-JUI
3 granted patents·4 pending applications·2 citations·filing 2020–2025
52Inventor score
Files withMEDIATEK INC7
Top patents by PatentIndex Score
7 records- 0185US11621211B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 0273US2024429113A1Lidded semiconductor packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0367US12080614B2Lidded semiconductor packageMEDIATEK INC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 0461US12388194B2Antenna-in-module package-on-package with air trenchesMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·14 claims
- 0554US2025372547A1Semiconductor structureMEDIATEK INC·Filed 2025·Application pending·0 cites
- 0653US2025062521A1Antenna package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0743US2025239517A1Semiconductor package and method for forming the sameMEDIATEK INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →