Inventor · disambiguated record
Ya-Yu Hsieh
Also filed as: HSIEH YA-YU
3 granted patents·5 pending applications·8 citations·filing 2005–2025
59Inventor score
Top patents by PatentIndex Score
8 records- 0177US7670686B2Long-term hydrophilic modification of PDMS substrate and method for manufacturing the sameUNIV NAT CHENG KUNG·Filed 2006·Granted Mar 2, 2010·7 cites·15 claims
- 0275US11011444B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·1 cites·17 claims
- 0372US2025183104A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0464US2021272866A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 0551US2019214323A1Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 0644US2017141007A1Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 0738US7498202B2Method for die attachingADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 3, 2009·0 cites·15 claims
- 0833US2007045863A1Package structure and fabrication process thereofHSIEH YA-YU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →