Inventor · disambiguated record
Yao-Pang Hsu
Also filed as: HSU YAO-PANG
7 granted patents·3 pending applications·10 citations·filing 2020–2024
77Inventor score
Technology areasH10W
Files withMEDIATEK INC10
Top patents by PatentIndex Score
10 records- 0197US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0285US11621211B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 0380US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 0475US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 0573US11705413B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 0673US2024429113A1Lidded semiconductor packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0767US12080614B2Lidded semiconductor packageMEDIATEK INC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 0861US12388194B2Antenna-in-module package-on-package with air trenchesMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·14 claims
- 0952US2023282626A1High-bandwidth package-on-package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1045US2021217707A1Semiconductor package having re-distribution layer structure on substrate componentMEDIATEK INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →