Inventor · disambiguated record
Yang-Chih Hsueh
Also filed as: HSUEH YANG-CHIH
8 granted patents·16 pending applications·11 citations·filing 2013–2025
77Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21NAT APPLIED RES LABORATORIES2UNIV NAT KAOHSIUNG SCIENCE & TECHNOLOGY1
Top patents by PatentIndex Score
24 records- 0192US10269611B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·10 cites·20 claims
- 0276US2025343162A1Warpage modulation through implantation and the structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0375US2025343164A1Semiconductor structure with stress relief layer and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US2025336687A1Packages with implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0575US2025343165A1Packaged device with air gap and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US2025343123A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0770US2025210540A1Semiconductor structure with stress relief layer and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0870US2025062136A1Packages with ImplantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0969US2025062247A1Warpage Modulation Through Implantation and the Structures ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1069US2025062204A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1169US2025192240A1Aqueous electrolyte composition, aqueous electrolyte, and zinc ion secondary battery including the sameUNIV NAT KAOHSIUNG SCIENCE & TECHNOLOGY·Filed 2023·Application pending·0 cites
- 1269US2025070045A1Packaged device with air gap and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1368US10867831B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 1467US10032698B2Interconnection structure with confinement layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 24, 2018·1 cites·20 claims
- 1559US10748803B2Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 1659US2025239564A1Treatment process for wafer bonding processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025191941A1Method and apparatus for bonding semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1858US2025277752A1Optical inspection system, method of optical inspection, and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1956US9381509B2Enclosed-channel reactor system and method to manufacture catalysts or supportNAT APPLIED RES LABORATORIES·Filed 2013·Granted Jul 5, 2016·0 cites·32 claims
- 2056US2025149497A1Bonding tool and chip-on-wafer bonding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2155US11948920B2Semiconductor device and method for manufacturing the same, and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 2253US9901917B2Enclosed-channel reactor method to manufacture catalysts or support materialsNAT APPLIED RES LABORATORIES·Filed 2016·Granted Feb 27, 2018·0 cites·25 claims
- 2353US2024170320A1Die bonding device, die bonding method and vacuum control method for pick-and-placer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2447US9673132B2Interconnection structure with confinement layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →