Inventor · disambiguated record
Yaping Hua
Also filed as: HUA YAPING
4 granted patents·87 citations·filing 2001–2008
78Inventor score
Files withMEMSIC INC4
Top patents by PatentIndex Score
4 records- 0189US7495462B2Method of wafer-level packaging using low-aspect ratio through-wafer holesMEMSIC INC·Filed 2006·Granted Feb 24, 2009·23 cites·19 claims
- 0286US6712983B2Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the sameMEMSIC INC·Filed 2001·Granted Mar 30, 2004·43 cites·36 claims
- 0384US7424826B2Single chip tri-axis accelerometerMEMSIC INC·Filed 2005·Granted Sep 16, 2008·16 cites·33 claims
- 0461US8011226B2Leakage detection method using micromachined-thermal-convection accelerometerMEMSIC INC·Filed 2008·Granted Sep 6, 2011·5 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →