Inventor · disambiguated record
Yasuhiro Ido
Also filed as: IDO YASUHIRO
10 granted patents·3 pending applications·350 citations·filing 1997–2006
89Inventor score
Top patents by PatentIndex Score
13 records- 0197US7115966B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Oct 3, 2006·254 cites·2 claims
- 0270US5998986AMethod of cleaning probe of probe card and probe-cleaning apparatusMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Dec 7, 1999·24 cites·8 claims
- 0361US6362514B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 26, 2002·29 cites·6 claims
- 0457US7667290B2Semiconductor device including a laser light blocking layer which overlaps fusesRENESAS TECH CORP·Filed 2005·Granted Feb 23, 2010·1 cites·5 claims
- 0557US6163062ASemiconductor device having a metallic fuse member and cutting method thereof with laser lightMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 19, 2000·23 cites·8 claims
- 0656US7728406B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Jun 1, 2010·1 cites·9 claims
- 0756US7709016B2Insect proof boardsNICHIHA KK·Filed 2006·Granted May 4, 2010·0 cites·5 claims
- 0847US2007063225A1Semiconductor device, and method for manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 0946US7034406B2Semiconductor device with alignment markRENESAS TECH CORP·Filed 2004·Granted Apr 25, 2006·2 cites·4 claims
- 1046US2007164394A1Semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 1138US6339250B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jan 15, 2002·9 cites·5 claims
- 1238US2004012071A1Semiconductor device, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 1334US6259147B1Semiconductor device having a fuse layerMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 10, 2001·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →