Inventor · disambiguated record
Yasushi Ishizaka
Also filed as: ISHIZAKA YASUSHI
8 granted patents·2 citations·filing 2016–2018
73Inventor score
Files withFURUKAWA ELECTRIC CO LTD8
Top patents by PatentIndex Score
8 records- 0178US10084153B2Filler material for organic electroluminescent element and method of sealing organic electroluminiscent elementFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Sep 25, 2018·1 cites·8 claims
- 0260US10196547B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·1 cites·13 claims
- 0359US10988646B2Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Apr 27, 2021·0 cites·4 claims
- 0450US10556974B2Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Feb 11, 2020·0 cites·6 claims
- 0547US9793511B2Filler material for organic electroluminescent element and method of sealing organic electroluminescent elementFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Oct 17, 2017·0 cites·20 claims
- 0642US10079360B2Resin composition for sealing electronic devices, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Sep 18, 2018·0 cites·9 claims
- 0741US10829669B2Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·7 claims
- 0835US10196534B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →