Inventor · disambiguated record
Yanggyoo Jung
Also filed as: JUNG YANGGYOO
9 granted patents·5 pending applications·5 citations·filing 2019–2023
78Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD14
Top patents by PatentIndex Score
14 records- 0187US11145637B2Semiconductor package including a substrate having two silicon layers formed on each otherSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·4 cites·19 claims
- 0285US11721679B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·19 claims
- 0378US12278222B2Method of fabricating semiconductor package including sub-interposer substratesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0465US12021032B2Semiconductor package having an interposer and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0559US2024421000A1Semiconductor die, semiconductor package and substrate dicing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0657US11694961B2Semiconductor package having an interposer and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·11 claims
- 0757US2024112998A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0852US12057408B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 0951US12237241B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1051US2024063129A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1150US2024021577A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1250US2024079349A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1349US11935867B2Semiconductor package with memory stack structure connected to logic dies via an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 1448US12272628B2Semiconductor package having interposer substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →