Inventor · disambiguated record
Yasuhiro Kawase
Also filed as: KAWASE YASUHIRO
28 granted patents·11 pending applications·89 citations·filing 1993–2022
95Inventor score
Top patents by PatentIndex Score
39 records- 0191US8124240B2Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structureOHMI TADAHIRO·Filed 2006·Granted Feb 28, 2012·10 cites·10 claims
- 0285US9476137B2Metal oxide film, laminate, metal member and process for producing the sameOHMI TADAHIRO·Filed 2012·Granted Oct 25, 2016·6 cites·11 claims
- 0385US8282807B2Metal member having a metal oxide film and method of manufacturing the sameOHMI TADAHIRO·Filed 2007·Granted Oct 9, 2012·4 cites·24 claims
- 0484US8206833B2Metal oxide film, laminate, metal member and process for producing the sameOHMI TADAHIRO·Filed 2006·Granted Jun 26, 2012·8 cites·13 claims
- 0582US9508648B2Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminateMITSUBISHI CHEM CORP·Filed 2013·Granted Nov 29, 2016·6 cites·24 claims
- 0682US7621281B2Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the sameMITSUBISHI CHEM CORP·Filed 2007·Granted Nov 24, 2009·7 cites·19 claims
- 0779US10731770B2Electric flow control valve and actuatorDENSO CORP·Filed 2016·Granted Aug 4, 2020·3 cites·12 claims
- 0879US9847298B2Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminateMITSUBISHI CHEM CORP·Filed 2016·Granted Dec 19, 2017·3 cites·11 claims
- 0974US9822294B2Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said compositionMITSUBISHI CHEM CORP·Filed 2014·Granted Nov 21, 2017·3 cites·24 claims
- 1072US7870733B2Fluid machine for rankine cycleDENSO CORP·Filed 2006·Granted Jan 18, 2011·3 cites·9 claims
- 1171US11115446B2Chat system and chat management apparatusWINGARC1ST INC·Filed 2020·Granted Sep 7, 2021·1 cites·14 claims
- 1266US9358967B2Rotary pump and braking system having the sameDENSO CORP·Filed 2013·Granted Jun 7, 2016·1 cites·6 claims
- 1362US8110534B2Cleaning solution for substrate for semiconductor device and process for producing substrate for semiconductor deviceKAWASE YASUHIRO·Filed 2008·Granted Feb 7, 2012·2 cites·12 claims
- 1462US7407569B2Gold plating solution and gold plating methodMITSUBISHI CHEM CORP·Filed 2004·Granted Aug 5, 2008·3 cites·21 claims
- 1558US9163627B2Rotating pump and brake system using sameNIPPON SOKEN·Filed 2013·Granted Oct 20, 2015·1 cites·8 claims
- 1658US7906004B2Method of forming oxide film by anodically oxidizing in an electrolyte solutionMITSUBISHI CHEM CORP·Filed 2005·Granted Mar 15, 2011·0 cites·4 claims
- 1758US2020186371A1Apparatus and methodWINGARC 1ST INC·Filed 2019·Application pending·0 cites
- 1857US8642187B2Structural member to be used in apparatus for manufacturing semiconductor or flat display, and method for producing the sameOHMI TADAHIRO·Filed 2007·Granted Feb 4, 2014·0 cites·8 claims
- 1953US11597896B2Cleaning liquid, cleaning method, and method for producing semiconductor waferMITSUBISHI CHEM CORP·Filed 2021·Granted Mar 7, 2023·0 cites·13 claims
- 2053US10400151B2Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said compositionMITSUBISHI CHEM CORP·Filed 2017·Granted Sep 3, 2019·0 cites·21 claims
- 2152US11225125B2Integrated valve deviceDENSO CORP·Filed 2020·Granted Jan 18, 2022·0 cites·8 claims
- 2252US11066627B2Cleaning agent composition for semiconductor device substrate, method of cleaning semiconductor device substrate, method of manufacturing semiconductor device substrate, and semiconductor device substrateMITSUBISHI CHEM CORP·Filed 2019·Granted Jul 20, 2021·0 cites·17 claims
- 2351US2022028681A1Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method of Preparing Semiconductor WaferMITSUBISHI CHEM CORP·Filed 2021·Application pending·0 cites
- 2449US5446181AMethod and apparatus for preparing 3-[N-(2-aminoethyl)]aminopropylalkoxysilaneSHINETSU CHEMICAL CO·Filed 1993·Granted Aug 29, 1995·13 cites·10 claims
- 2549US2009038957A1Gold plating liquid and gold plating methodMITSUBISHI CHEM CORP·Filed 2005·Application pending·0 cites
- 2648US9960092B2Interlayer filler composition for three-dimensional integrated circuitMITSUBISHI CHEM CORP·Filed 2013·Granted May 1, 2018·0 cites·34 claims
- 2747US2014178236A1Rotary pump and brake device having the sameDENSO CORP·Filed 2013·Application pending·0 cites
- 2846US2010281901A1Air conditioner for vehicleNIPPON SOKEN·Filed 2010·Application pending·0 cites
- 2945US5759736APhotoresist compositionMITSUBISHI CHEM CORP·Filed 1997·Granted Jun 2, 1998·9 cites·9 claims
- 3045US2022363554A1Silica particle, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2022·Application pending·0 cites
- 3143US11391499B2Heat pump cycle device and valve deviceDENSO CORP·Filed 2020·Granted Jul 19, 2022·0 cites·11 claims
- 3243US2005020463A1Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the sameMITSUBISHI CHEM CORP·Filed 2004·Application pending·0 cites
- 3342US2013319038A1Vehicle cooling systemKAWASE YASUHIRO·Filed 2012·Application pending·0 cites
- 3440US5698362A1,2 quinone diazide photosensitive resin composition containing select additive and method for forming a photoresist patternMITSUBISHI CHEM CORP·Filed 1997·Granted Dec 16, 1997·6 cites·15 claims
- 3539US12189795B2Chatbot control device and chatbot control methodWINGARC1ST INC·Filed 2022·Granted Jan 7, 2025·0 cites·4 claims
- 3639US2017220529A1Data processing system, data embedding device and data embedding programWINGARC1ST INC·Filed 2016·Application pending·0 cites
- 3733US10125289B2Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor deviceMITSUBISHI CHEM CORP·Filed 2015·Granted Nov 13, 2018·0 cites·13 claims
- 3832US2012240479A1Polishing slurry for silicon carbide and polishing method thereforDOI TOSHIRO·Filed 2010·Application pending·0 cites
- 3932US2017287866A1Interlayer filler composition for semiconductor device and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →