Inventor · disambiguated record
Yasutoshi Kurihara
Also filed as: KAGAMI TERUYUKI · KURIHARA YASUTOSHI
15 granted patents·3 pending applications·584 citations·filing 1975–2003
95Inventor score
Top patents by PatentIndex Score
18 records- 0189US6434008B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·84 cites·11 claims
- 0289US6353258B1Semiconductor moduleHITACHI LTD·Filed 2000·Granted Mar 5, 2002·65 cites·44 claims
- 0389US5956231ASemiconductor device having power semiconductor elementsHITACHI LTD·Filed 1995·Granted Sep 21, 1999·85 cites·20 claims
- 0487US4649990AHeat-conducting cooling moduleHITACHI LTD·Filed 1985·Granted Mar 17, 1987·75 cites·12 claims
- 0581US6710263B2Semiconductor devicesRENESAS TECH CORP·Filed 2001·Granted Mar 23, 2004·33 cites·19 claims
- 0680US4352120ASemiconductor device using SiC as supporter of a semiconductor elementHITACHI LTD·Filed 1980·Granted Sep 28, 1982·44 cites·9 claims
- 0778US4143385APhotocouplerHITACHI LTD·Filed 1977·Granted Mar 6, 1979·36 cites·12 claims
- 0876US6579623B2Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2002·Granted Jun 17, 2003·20 cites·16 claims
- 0976US4151502ASemiconductor transducerHITACHI LTD·Filed 1977·Granted Apr 24, 1979·21 cites·12 claims
- 1075US4058821APhoto-coupler semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1976·Granted Nov 15, 1977·36 cites·17 claims
- 1169US7141741B2Circuit boardHITACHI HARAMACHI ELECTRONICS·Filed 2003·Granted Nov 28, 2006·12 cites·1 claims
- 1267US4556899AInsulated type semiconductor devicesHITACHI LTD·Filed 1982·Granted Dec 3, 1985·29 cites·12 claims
- 1362US4008485AGallium arsenide infrared light emitting diodeHITACHI LTD·Filed 1975·Granted Feb 15, 1977·21 cites·14 claims
- 1452US4001859APhoto couplerHITACHI LTD·Filed 1976·Granted Jan 4, 1977·14 cites·16 claims
- 1544US3998672AMethod of producing infrared luminescent diodesHITACHI LTD·Filed 1975·Granted Dec 21, 1976·9 cites·5 claims
- 1639US2003201530A1Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2003·Application pending·0 cites
- 1739US2003016502A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 1837US2005029666A1Semiconductor device structural body and electronic deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →