Inventor · disambiguated record
Yasuhiko Kusama
Also filed as: KUSAMA YASUHIKO
10 granted patents·5 pending applications·39 citations·filing 2007–2023
85Inventor score
Top patents by PatentIndex Score
15 records- 0194US9627309B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 18, 2017·12 cites·8 claims
- 0288US9627308B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 18, 2017·6 cites·9 claims
- 0383US9852970B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Dec 26, 2017·4 cites·9 claims
- 0483US8835773B2Wiring board and method of manufacturing the sameMURAMATSU SHIGETSUGU·Filed 2010·Granted Sep 16, 2014·8 cites·4 claims
- 0573US8037596B2Method for manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2007·Granted Oct 18, 2011·4 cites·6 claims
- 0672US8222532B2Method for manufacturing a wiring boardMURAMATSU SHIGETSUGU·Filed 2011·Granted Jul 17, 2012·3 cites·8 claims
- 0768US9497863B2Wiring substrate and method of making wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 15, 2016·2 cites·11 claims
- 0865US12315755B2Substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2023·Granted May 27, 2025·0 cites·10 claims
- 0951US2010090352A1Flip-chip substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 1048US2008283277A1Wiring board manufacturing method and wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 1146US2021175054A1Electrostatic chuck and substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2020·Application pending·0 cites
- 1244US2008223612A1Wiring substrate and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 1344US2010101851A1Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 1440US10211119B2Electronic component built-in substrate and electronic deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Feb 19, 2019·0 cites·13 claims
- 1534US9560768B2Wiring substrate and method of making wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 31, 2017·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Yasuhiko Kusama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →