Inventor · disambiguated record
Yasunori Kutsuma
Also filed as: KUTSUMA YASUNORI
17 granted patents·3 pending applications·15 citations·filing 2015–2024
89Inventor score
Top patents by PatentIndex Score
20 records- 0187US11359307B2Vapour-phase epitaxial growth method, and method for producing substrate equipped with epitaxial layerKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2017·Granted Jun 14, 2022·4 cites·12 claims
- 0284US12471339B2SiC semiconductor deviceROHM CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·21 claims
- 0381US12320030B2Method of using sic containerKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2023·Granted Jun 3, 2025·0 cites·6 claims
- 0480US11626490B2SiC semiconductor deviceROHM CO LTD·Filed 2019·Granted Apr 11, 2023·2 cites·18 claims
- 0578US12255227B2SiC semiconductor deviceROHM CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·19 claims
- 0678US12021120B2SiC semiconductor deviceROHM CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·26 claims
- 0778US2025120148A1SiC SEMICONDUCTOR DEVICEROHM CO LTD·Filed 2024·Application pending·0 cites
- 0874US12325930B2Manufacturing device for SiC semiconductor substrateKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2022·Granted Jun 10, 2025·0 cites·11 claims
- 0966USD1056861SPower semiconductor moduleROHM CO LTD·Filed 2021·Granted Jan 7, 2025·3 cites·1 claims
- 1066US10508361B2Method for manufacturing semiconductor waferKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2016·Granted Dec 17, 2019·1 cites·11 claims
- 1163US11621319B2SiC semiconductor deviceROHM CO LTD·Filed 2019·Granted Apr 4, 2023·0 cites·17 claims
- 1262US10388536B2Etching method for SiC substrate and holding containerTOYO TANSO CO·Filed 2015·Granted Aug 20, 2019·1 cites·2 claims
- 1360USD1030686SPower semiconductor moduleROHM CO LTD·Filed 2021·Granted Jun 11, 2024·2 cites·1 claims
- 1460USD994624SPower semiconductor moduleROHM CO LTD·Filed 2021·Granted Aug 8, 2023·2 cites·1 claims
- 1552US2023335633A1Wide bandgap semiconductor deviceROHM CO LTD·Filed 2022·Application pending·0 cites
- 1649US2023109650A1Semiconductor device, semiconductor package, and methods for manufacturing theseROHM CO LTD·Filed 2021·Application pending·0 cites
- 1748US10665465B2Surface treatment method for SiC substrateKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2015·Granted May 26, 2020·0 cites·16 claims
- 1845US11916112B2SiC semiconductor deviceROHM CO LTD·Filed 2019·Granted Feb 27, 2024·0 cites·20 claims
- 1938US11365491B2Method for producing SiC substrate provided with graphene precursor and method for surface treating SiC substrateKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2017·Granted Jun 21, 2022·0 cites·11 claims
- 2033USD1021831SPower semiconductor moduleROHM CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →