Inventor · disambiguated record
Yao-Tong Lai
Also filed as: LAI YAO-TONG
7 granted patents·2 pending applications·6 citations·filing 2017–2025
76Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9
Top patents by PatentIndex Score
9 records- 0188US10283377B1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·6 cites·13 claims
- 0287US12358194B2Molded semiconductor device and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0387US2025303621A1Molding apparatus and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0483US12011859B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 0579US11731327B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 0674US12230549B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 0772US2025167060A1Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0862US11446851B2Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 0962US11309226B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Yao-Tong Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →