Inventor · disambiguated record
Yawei Liang
Also filed as: LIANG YAWEI
2 granted patents·0 citations·filing 2019–2019
23Inventor score
Files withINTEL CORP2
Top patents by PatentIndex Score
2 records- 0149US11804470B2Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage controlINTEL CORP·Filed 2019·Granted Oct 31, 2023·0 cites·20 claims
- 0244US11562940B2Integrated heat spreader comprising a silver and sintering silver layered structureINTEL CORP·Filed 2019·Granted Jan 24, 2023·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →