Inventor · disambiguated record
Yaqin Liu
Also filed as: LIU YAQIN
1 granted patent·19 pending applications·0 citations·filing 2022–2025
13Inventor score
Files withYANGTZE MEMORY TECH CO LTD20
Top patents by PatentIndex Score
20 records- 0175US2025344392A1Three-dimensional nand memory and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0264US12396171B2Method of fabricating three-dimensional NAND memoryYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·12 claims
- 0362US2025336437A1Memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0462US2025338471A1Manufacturing method of memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0562US2025159872A1Semiconductor device and fabrication method thereof, memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0659US2025331173A1Semiconductor devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0758US2025311239A1Semiconductor device and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025287580A1Semiconductor device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0958US2025311242A1Memory device and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1057US2025372513A1Semiconductor structures and fabrication methods thereof, semiconductor devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1156US2024422959A1Semiconductor structures and fabrication methods thereof, memory and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1256US2025338510A1Semiconductor devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1355US2024387402A1Semiconductor device, manufacturing method, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1455US2025176171A1Memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1554US2024098973A1Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1654US2024023320A1Memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1753US2025280529A1Semiconductor devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1852US2024389296A1Semiconductor structure, fabrication method thereof, memory and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1951US2023413531A1Memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2050US2025338491A1Memory and forming method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →