Inventor · disambiguated record
Yasuo Miyadera
Also filed as: MIYADERA YASUO
40 granted patents·949 citations·filing 1971–2008
98Inventor score
Top patents by PatentIndex Score
40 records- 0191US5997829AEnvironment purifying materialHITACHI CHEMICAL CO LTD·Filed 1996·Granted Dec 7, 1999·161 cites·20 claims
- 0290US6001277ALiquid-crystal alignment filmHITACHI CHEMICAL CO LTD·Filed 1996·Granted Dec 14, 1999·131 cites·13 claims
- 0388US4528223AComposite fibrous productHITACHI LTD·Filed 1981·Granted Jul 9, 1985·49 cites·13 claims
- 0487US5098999AAmino-protected dopa derivative and production thereofHITACHI CHEMICAL CO LTD·Filed 1990·Granted Mar 24, 1992·31 cites·7 claims
- 0585US4833204AEpoxy resin composition for a copper-clad laminateHITACHI CHEMICAL CO LTD·Filed 1988·Granted May 23, 1989·33 cites·5 claims
- 0685US4446191ALaminates comprising prepregs metal cladHITACHI CHEMICAL CO LTD·Filed 1981·Granted May 1, 1984·39 cites·16 claims
- 0778US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 0878US5667899AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 16, 1997·35 cites·7 claims
- 0976US4510008AContinuous production of copper-clad laminateHITACHI CHEMICAL CO LTD·Filed 1982·Granted Apr 9, 1985·31 cites·11 claims
- 1075US4526838APolyamino-bis-imide resinHITACHI CHEMICAL CO LTD·Filed 1983·Granted Jul 2, 1985·43 cites·12 claims
- 1175US4064289AMethod of making a semiconductor deviceHITACHI LTD·Filed 1975·Granted Dec 20, 1977·30 cites·7 claims
- 1272US5243019AAlkenyl-fluorine-containing aromatic polyamideHITACHI CHEMICAL CO LTD·Filed 1991·Granted Sep 7, 1993·18 cites·8 claims
- 1371US5605763AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Feb 25, 1997·40 cites·9 claims
- 1471US5571579AAlignment film for liquid crystal, liquid crystal-sandwiched panel, liquid crystal display module and material for liquid crystal alignment filmHITACHI CHEMICAL CO LTD·Filed 1994·Granted Nov 5, 1996·26 cites·14 claims
- 1570US7258918B2Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structureHITACHI CHEMICAL CO LTD·Filed 2003·Granted Aug 21, 2007·13 cites·19 claims
- 1670US5270438AFluorine-containing polyimides and precursors thereofHITACHI CHEMICAL CO LTD·Filed 1991·Granted Dec 14, 1993·14 cites·20 claims
- 1769US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 1867US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 1966US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 2065US5115089AProcesses for preparation of polyimide-isoindroquinazolinedione and precursor thereofHITACHI CHEMICAL CO LTD·Filed 1988·Granted May 19, 1992·14 cites·13 claims
- 2165US3963796AEpoxy resin composition having excellent latent hardening characteristicsHITACHI LTD·Filed 1971·Granted Jun 15, 1976·12 cites·8 claims
- 2264US7771559B2Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structureHITACHI CHEMICAL CO LTD·Filed 2006·Granted Aug 10, 2010·2 cites·12 claims
- 2363US5508357APolyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of polyimidesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 16, 1996·21 cites·3 claims
- 2461US5510425APolyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimidesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 23, 1996·14 cites·2 claims
- 2560US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 2660US4225702AMethod of preparing polyamide acid type intermediates for processing of semiconductorsHITACHI CHEMICAL CO LTD·Filed 1979·Granted Sep 30, 1980·12 cites·2 claims
- 2759US5527621AMethod for surface treatment of polyimide resin molded articlesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Jun 18, 1996·15 cites·10 claims
- 2857US4985509AHeat curable resin compositionHITACHI LTD·Filed 1989·Granted Jan 15, 1991·16 cites·5 claims
- 2954US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 3053US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 3152US4598115APolyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymerHITACHI CHEMICAL CO LTD·Filed 1984·Granted Jul 1, 1986·8 cites·9 claims
- 3250US7528488B2Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structureHITACHI CHEMICAL CO LTD·Filed 2006·Granted May 5, 2009·0 cites·7 claims
- 3350US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 3447US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 3546US4447596AMethod of preparing polyamide acid for processing of semiconductorsHITACHI CHEMICAL CO LTD·Filed 1981·Granted May 8, 1984·11 cites·4 claims
- 3645US5608013APolyimides and thermosetting resin compositions containing the sameHITACHI CHEMICAL CO LTD·Filed 1995·Granted Mar 4, 1997·8 cites·7 claims
- 3744US4707316APolyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymerHITACHI CHEMICAL CO LTD·Filed 1986·Granted Nov 17, 1987·6 cites·6 claims
- 3841US4485234AMethod of preparing polyamide acid for processing of semiconductorsHITACHI CHEMICAL CO LTD·Filed 1984·Granted Nov 27, 1984·8 cites·7 claims
- 3936US4511681AProcess for producing a polyimide solutionHITACHI CHEMICAL CO LTD·Filed 1983·Granted Apr 16, 1985·3 cites·16 claims
- 4031US5401878AFluorine-containing polyimides and precursors thereofHITACHI CHEMICAL CO LTD·Filed 1993·Granted Mar 28, 1995·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →