Inventor · disambiguated record
Yasuo Moriguchi
Also filed as: MORIGUCHI YASUO
11 granted patents·1 pending application·233 citations·filing 1977–2005
92Inventor score
Files withMITSUBISHI ELECTRIC CORP4CENTRAL GLASS CO LTD3MITSUBISHI HEAVY IND LTD2KOBE STEEL LTD1RENESAS TECH CORP1
Top patents by PatentIndex Score
12 records- 0189US6674623B1Microcomputer equipped with built-in temperature sensorMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 6, 2004·60 cites·13 claims
- 0279US7148567B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Dec 12, 2006·10 cites·3 claims
- 0374US5510141ACoating composition and method for forming thin film on substrate using sameCENTRAL GLASS CO LTD·Filed 1995·Granted Apr 23, 1996·35 cites·6 claims
- 0472US5137749AMethod of forming metal oxide film by using metal alkoxide solutionCENTRAL GLASS CO LTD·Filed 1990·Granted Aug 11, 1992·37 cites·9 claims
- 0568US4134758ATitanium alloy with high internal friction and method of heat-treating the sameMITSUBISHI HEAVY IND LTD·Filed 1977·Granted Jan 16, 1979·15 cites·2 claims
- 0662US6333643B1Hotplug tolerant I/O circuitMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 25, 2001·10 cites·13 claims
- 0758US6088821ALogic circuit verification device for semiconductor integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 11, 2000·37 cites·6 claims
- 0858US4167427AHeat treatment of titanium alloysMITSUBISHI HEAVY IND LTD·Filed 1977·Granted Sep 11, 1979·8 cites·2 claims
- 0943US4398406AMethod for producing cold rolled titanium stripsKOBE STEEL LTD·Filed 1981·Granted Aug 16, 1983·5 cites·5 claims
- 1039US6170072B1Logic circuit verification apparatus and method for semiconductor integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jan 2, 2001·8 cites·12 claims
- 1139US5338350AInk composition for forming thin filmCENTRAL GLASS CO LTD·Filed 1993·Granted Aug 16, 1994·8 cites·7 claims
- 1234US2003102556A1Semiconductor integrated circuit deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →