Inventor · disambiguated record
Yasuki Morino
Also filed as: MORINO YASUKI
5 granted patents·1 pending application·27 citations·filing 1998–2010
75Inventor score
Top patents by PatentIndex Score
6 records- 0171US6472324B2Method of manufacturing trench type element isolation structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 29, 2002·17 cites·5 claims
- 0267US7646055B2Semiconductor device and method of fabrication thereofRENESAS TECH CORP·Filed 2008·Granted Jan 12, 2010·3 cites·12 claims
- 0352US7846788B2Semiconductor device and method of fabrication thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Dec 7, 2010·0 cites·5 claims
- 0446US8039336B2Semiconductor device and method of fabrication thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Oct 18, 2011·0 cites·5 claims
- 0543US2005287777A1Semiconductor device and method of fabrication thereofMORINO YASUKI·Filed 2005·Application pending·0 cites
- 0638US6206012B1Method of avoiding wall particle contamination in depositing filmsMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 27, 2001·7 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →