Inventor · disambiguated record
Yasufumi Nakasu
Also filed as: NAKASU YASUFUMI
3 granted patents·63 citations·filing 1993–2002
69Inventor score
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0172US6213356B1Bump forming apparatus and bump forming methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·32 cites·20 claims
- 0261US5305944ABonding method and bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 26, 1994·31 cites·24 claims
- 0338US6854671B2Nozzle for ejecting molten metalMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Feb 15, 2005·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Yasufumi Nakasu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →