Inventor · disambiguated record
Yasutomo Okajima
Also filed as: OKAJIMA YASUTOMO
3 granted patents·3 pending applications·35 citations·filing 2003–2009
70Inventor score
Top patents by PatentIndex Score
6 records- 0183US7770500B2Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2005·Granted Aug 10, 2010·9 cites·22 claims
- 0283US7426883B2Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2003·Granted Sep 23, 2008·17 cites·18 claims
- 0377US7845529B2Method for processing substrate, apparatus for processing substrate, method for conveying substrate and mechanism for conveying substrateMITSUBOSHI DIAMOND IND CO LTD·Filed 2009·Granted Dec 7, 2010·9 cites·3 claims
- 0435US2005229755A1Pasted base board cutting system and base board cutting methodOKAJIMA YASUTOMO·Filed 2003·Application pending·0 cites
- 0534US2007214925A1Substrate dicing system, substrate manufacturing apparatus, and substrate dicing methodMITSUBISHI DIAMOND IND CO LTD·Filed 2004·Application pending·0 cites
- 0629US2008190981A1Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying SubstrateOKAJIMA YASUTOMO·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yasutomo Okajima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →