Inventor · disambiguated record
Yasuhiro Okawa
Also filed as: OKAWA YASUHIRO
7 granted patents·6 pending applications·5 citations·filing 2013–2023
72Inventor score
Files withPANASONIC IP MAN CO LTD4FUJITSU LTD3JAPAN LIFELINE CO LTD3DAINIPPON PRINTING CO LTD2KUBOTA KK1
Top patents by PatentIndex Score
13 records- 0175US9831900B2Wireless communication deviceFUJITSU LTD·Filed 2016·Granted Nov 28, 2017·4 cites·6 claims
- 0271US12508677B2Solder paste and bonded structurePANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·7 claims
- 0363US11618110B2Solder paste and mounting structurePANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·6 claims
- 0459US9231626B2Wireless communication apparatus, Doherty amplifier, and method for controlling wireless communicationFUJITSU LTD·Filed 2013·Granted Jan 5, 2016·1 cites·20 claims
- 0555US11413585B2Membrane element and membrane separation deviceKUBOTA KK·Filed 2020·Granted Aug 16, 2022·0 cites·18 claims
- 0655US2023414907A1Catheter and method of actuating balloonJAPAN LIFELINE CO LTD·Filed 2023·Application pending·0 cites
- 0754US2021121992A1Solder paste and joining structurePANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 0854US2023201548A1Catheter, balloon expansion method, balloon compression methodJAPAN LIFELINE CO LTD·Filed 2022·Application pending·0 cites
- 0953US12028986B2Mounting method and mounting structure formed by the samePANASONIC IP MAN CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·6 claims
- 1044US2023321396A1Guiding catheterJAPAN LIFELINE CO LTD·Filed 2020·Application pending·0 cites
- 1139US2024004294A1Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2021·Application pending·0 cites
- 1238US11123960B2Film mold and imprinting methodDAINIPPON PRINTING CO LTD·Filed 2016·Granted Sep 21, 2021·0 cites·10 claims
- 1333US2018138867A1Base station and distortion compensation methodFUJITSU LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →