Inventor · disambiguated record
Yasushi Okuda
Also filed as: OKUDA YASUSHI
16 granted patents·769 citations·filing 1984–2002
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD11MATSUSHITA ELECTRONICS CORP2SAKURA COLOR PROD CORP2DACC DOCUMENT UPDATE1
Top patents by PatentIndex Score
16 records- 0197US5945834ASemiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 31, 1999·160 cites·7 claims
- 0296US6005401ASemiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 21, 1999·140 cites·8 claims
- 0390US5359554ASemiconductor memory device having an energy gap for high speed operationMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Oct 25, 1994·100 cites·17 claims
- 0488US4657591AInk compositionSAKURA COLOR PROD CORP·Filed 1984·Granted Apr 14, 1987·50 cites·17 claims
- 0585US6169307B1Nonvolatile semiconductor memory device comprising a memory transistor, a select transistor, and an intermediate diffusion layerMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Jan 2, 2001·51 cites·19 claims
- 0685US5627779ANon-volatile semiconductor memory having an array of non-volatile memory cells and method for driving the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted May 6, 1997·65 cites·12 claims
- 0780US6323663B1Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·37 cites·7 claims
- 0871US5715196AMethod for driving a non-volatile semiconductor memoryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Feb 3, 1998·30 cites·7 claims
- 0970US5640345ASemiconductor memory device and fabrication processMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 17, 1997·32 cites·18 claims
- 1069US6657893B2Nonvolatile semiconductor memory device and method for driving the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 2, 2003·14 cites·22 claims
- 1166US5510639ANon-volatile semiconductor memory having a ring-shaped floating gateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Apr 23, 1996·30 cites·13 claims
- 1261US6377490B1Nonvolatile semiconductor memory device and method for driving the sameMATSUSHITA ELECTRONICS CORP·Filed 2000·Granted Apr 23, 2002·10 cites·9 claims
- 1352US5418187AMethod for extending electrically conductive layer into electrically insulating layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted May 23, 1995·20 cites·70 claims
- 1449US6753222B2Method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 22, 2004·4 cites·19 claims
- 1549US5698614AFluorescent ink composition for use in marking pensSAKURA COLOR PROD CORP·Filed 1995·Granted Dec 16, 1997·14 cites·5 claims
- 1641US6472281B2Method for fabricating semiconductor device using a CVD insulator filmDACC DOCUMENT UPDATE·Filed 1999·Granted Oct 29, 2002·12 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →