Inventor · disambiguated record
Yasuto Onitsuka
Also filed as: ONITSUKA YASUTO
11 granted patents·191 citations·filing 1994–2008
91Inventor score
Top patents by PatentIndex Score
11 records- 0181US5501005AMounting device of electronic components and a mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 26, 1996·34 cites·12 claims
- 0279US6618937B2Method of assembling electronic applications and display devicesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 16, 2003·23 cites·18 claims
- 0374US7107672B2Method of mounting electronic parts on a flexible printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 19, 2006·22 cites·4 claims
- 0473US8029638B2Component mounting apparatus and methodPANASONIC CORP·Filed 2008·Granted Oct 4, 2011·6 cites·2 claims
- 0567US5628660ABonding apparatus and bonding method of devicesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted May 13, 1997·39 cites·24 claims
- 0654US5513792ABonding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted May 7, 1996·23 cites·8 claims
- 0753US5501004AOuter-lead bonding apparatus and method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 26, 1996·23 cites·6 claims
- 0845US6869491B2Bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 22, 2005·2 cites·5 claims
- 0941US8567054B2ACF attachment device and ACF attachment methodONITSUKA YASUTO·Filed 2007·Granted Oct 29, 2013·0 cites·4 claims
- 1041US5591295ABonding apparatus for electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jan 7, 1997·12 cites·5 claims
- 1137US5839645ABonding machine of electronic components and bonding method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Nov 24, 1998·7 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →