Inventor · disambiguated record
Yasushi Ookura
Also filed as: OOKURA YASUSHI
10 granted patents·1 pending application·75 citations·filing 2002–2025
86Inventor score
Top patents by PatentIndex Score
11 records- 0187US8716746B2Semiconductor deviceKOYAMA MASAKI·Filed 2011·Granted May 6, 2014·11 cites·19 claims
- 0286US8952449B2Semiconductor device having both IGBT area and diode areaKOYAMA MASAKI·Filed 2011·Granted Feb 10, 2015·8 cites·9 claims
- 0385US7145254B2Transfer-molded power device and method for manufacturing transfer-molded power deviceDENSO CORP·Filed 2002·Granted Dec 5, 2006·45 cites·3 claims
- 0477US2025357230A1Semiconductor device, semiconductor module, and method for manufacturing semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0568US12482714B2Semiconductor device, semiconductor module, and method for manufacturing semiconductor deviceDENSO CORP·Filed 2022·Granted Nov 25, 2025·0 cites·11 claims
- 0666US9502327B2Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2015·Granted Nov 22, 2016·2 cites·14 claims
- 0765US8405194B2Semiconductor device including two heat sinks and method of manufacturing the sameNISHIHATA MASAYOSHI·Filed 2010·Granted Mar 26, 2013·3 cites·29 claims
- 0864US12476163B2Semiconductor device and semiconductor moduleDENSO CORP·Filed 2022·Granted Nov 18, 2025·0 cites·4 claims
- 0964US9691713B2Semiconductor deviceDENSO CORP·Filed 2014·Granted Jun 27, 2017·2 cites·7 claims
- 1064US8497572B2Semiconductor module and method of manufacturing the sameFUKUTANI KEITA·Filed 2011·Granted Jul 30, 2013·3 cites·26 claims
- 1161US10002807B2Semiconductor deviceDENSO CORP·Filed 2013·Granted Jun 19, 2018·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →