Inventor · disambiguated record
Yasuhiro Oura
Also filed as: OURA YASUHIRO
5 granted patents·131 citations·filing 1988–2007
80Inventor score
Top patents by PatentIndex Score
5 records- 0189US4925515AMethod and apparatus for applying a protective tape on a wafer and cutting it out to shapeTAKATORI CORP·Filed 1988·Granted May 15, 1990·108 cites·4 claims
- 0287US7344689B2Silicon wafer for IGBT and method for producing sameSUMCO CORP·Filed 2006·Granted Mar 18, 2008·12 cites·2 claims
- 0383US7846252B2Silicon wafer for IGBT and method for producing sameSUMCO CORP·Filed 2007·Granted Dec 7, 2010·8 cites·4 claims
- 0462US7582540B2Method for manufacturing SOI waferSUMCO CORP·Filed 2005·Granted Sep 1, 2009·2 cites·2 claims
- 0554US7615467B2Method for manufacturing SOI waferSUMCO CORP·Filed 2005·Granted Nov 10, 2009·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →