Inventor · disambiguated record
Yasuhiko Sakaki
Also filed as: SAKAKI YASUHIKO
7 granted patents·140 citations·filing 1999–2003
87Inventor score
Files withELECTROPLATING ENG7
Top patents by PatentIndex Score
7 records- 0190US6454918B1Cup type plating apparatusELECTROPLATING ENG·Filed 2000·Granted Sep 24, 2002·53 cites·18 claims
- 0288US6875333B2Plating apparatus for waferELECTROPLATING ENG·Filed 2003·Granted Apr 5, 2005·25 cites·20 claims
- 0383US7108776B2Plating apparatus and plating methodELECTROPLATING ENG·Filed 2002·Granted Sep 19, 2006·18 cites·25 claims
- 0479US6482300B2Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereofELECTROPLATING ENG·Filed 2001·Granted Nov 19, 2002·21 cites·4 claims
- 0560US6610182B2Cup-type plating apparatus and method for plating wafersELECTROPLATING ENG·Filed 2001·Granted Aug 26, 2003·8 cites·15 claims
- 0658US6991711B2Cup type plating apparatusELECTROPLATING ENG·Filed 2002·Granted Jan 31, 2006·5 cites·4 claims
- 0746US6332963B1Cup-type plating apparatus and method for plating wafer using the sameELECTROPLATING ENG·Filed 1999·Granted Dec 25, 2001·10 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Yasuhiko Sakaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →