Inventor · disambiguated record
Yasuyuki Sanda
Also filed as: SANDA YASUYUKI
7 granted patents·6 pending applications·8 citations·filing 2014–2023
74Inventor score
Files withMITSUBISHI ELECTRIC CORP13
Top patents by PatentIndex Score
13 records- 0184US10768127B2Thermal conductivity measurement apparatus and thermal conductivity measurement methodMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 8, 2020·3 cites·13 claims
- 0272US11152280B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 19, 2021·2 cites·13 claims
- 0371US9892992B2Swaged heat sink and heat sink integrated power moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 0452US12477704B2Power semiconductor device and method of manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Nov 18, 2025·0 cites·14 claims
- 0552US2025167073A1Power semiconductor device and method of manufacturing power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0652US2025301760A1Power semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0751US2025246512A1Power module, method of manufacturing power module, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0848US2023275035A1Semiconductor module, method for manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0947US2024222233A1Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1046US2024274489A1Power Semiconductor Device, Method for Manufacturing Same, and Power Conversion DeviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1145US10775329B2Thermal conductivity measurement device and thermal conductivity measurement methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 15, 2020·0 cites·20 claims
- 1239US11322430B2Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resinMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 3, 2022·0 cites·9 claims
- 1336US11049787B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 29, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →