Inventor · disambiguated record
Yasushi Sawamura
Also filed as: SAWAMURA YASUSHI
10 granted patents·260 citations·filing 1992–2019
91Inventor score
Top patents by PatentIndex Score
10 records- 0191US6303219B1Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor deviceTORAY INDUSTRIES·Filed 1997·Granted Oct 16, 2001·71 cites·23 claims
- 0277US8138580B2Adhesive composition for electronic components, and adhesive sheet for electronic components using the sameKONISHI YUKITSUNA·Filed 2008·Granted Mar 20, 2012·7 cites·15 claims
- 0377US6716529B2Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor deviceTORAY INDUSTRIES·Filed 2001·Granted Apr 6, 2004·13 cites·34 claims
- 0468US11287566B2Plastic optical fiber and plastic optical fiber cordTORAY INDUSTRIES·Filed 2019·Granted Mar 29, 2022·1 cites·13 claims
- 0568US5567749ASemiconductor device-encapsulating epoxy resin compositionTORAY INDUSTRIES·Filed 1994·Granted Oct 22, 1996·43 cites·6 claims
- 0668US5360837ASemiconductor device-encapsulating epoxy resin compositionTORAY INDUSTRIES·Filed 1992·Granted Nov 1, 1994·44 cites·7 claims
- 0764US5476884ASemiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agentsTORAY INDUSTRIES·Filed 1994·Granted Dec 19, 1995·37 cites·10 claims
- 0854US5798400AEpoxy resin compoundTORAY INDUSTRIES·Filed 1995·Granted Aug 25, 1998·18 cites·8 claims
- 0949US5985455ASemiconductor element sealed with an epoxy resin compoundTORAY INDUSTRIES·Filed 1998·Granted Nov 16, 1999·14 cites·14 claims
- 1044US5854316AEpoxy resin compositionTORAY INDUSTRIES·Filed 1996·Granted Dec 29, 1998·12 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →