Inventor · disambiguated record
Yanmei Song
Also filed as: SONG YANMEI
0 granted patents·6 pending applications·0 citations·filing 2015–2024
Top patents by PatentIndex Score
6 records- 0173US2025391755A1Package comprising dummy silicon structure located between integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0261US2025343176A1Package comprising an interposer package with metallization portions, and a passive device and a bridge between the metallization portionsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0357US2025357448A1Package comprising a passive device with a front side protection layerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0454US2024071993A1Package comprising a chiplet located between two metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0554US2024072032A1Package comprising a chiplet located between an integrated device and a metallization portionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0632US2017176173A1Measuring surface layer thicknessINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →