Inventor · disambiguated record
Yasir Sulehria
Also filed as: SULEHRIA YASIR
8 granted patents·5 pending applications·16 citations·filing 2017–2024
79Inventor score
Files withIBM13
Top patents by PatentIndex Score
13 records- 0190US11309216B2Large grain copper interconnect lines for MRAMIBM·Filed 2020·Granted Apr 19, 2022·3 cites·15 claims
- 0288US11114606B2MRAM devices containing a harden gap fill dielectric materialIBM·Filed 2019·Granted Sep 7, 2021·6 cites·18 claims
- 0384US10910435B2Stackable symmetrical operation memory bit cell structure with bidirectional selectorsIBM·Filed 2019·Granted Feb 2, 2021·3 cites·8 claims
- 0484US10395925B2Patterning material film stack comprising hard mask layer having high metal content interface to resist layerIBM·Filed 2017·Granted Aug 27, 2019·4 cites·20 claims
- 0567US11621297B2Stackable symmetrical operation memory bit cell structure with bidirectional selectorsIBM·Filed 2020·Granted Apr 4, 2023·0 cites·20 claims
- 0665US12035641B2Josephson junction device fabricated by direct write ion implantationIBM·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 0760US12482742B2Enhanced linerless viasIBM·Filed 2021·Granted Nov 25, 2025·0 cites·14 claims
- 0859US2025311319A1Stacked field effect transistorsIBM·Filed 2024·Application pending·0 cites
- 0952US2023386897A1Angled contact with a negative tapered profileIBM·Filed 2022·Application pending·0 cites
- 1050US2023187510A1Angled via for tip to tip margin improvementIBM·Filed 2021·Application pending·0 cites
- 1148US10578981B2Post-lithography defect inspection using an e-beam inspection toolIBM·Filed 2018·Granted Mar 3, 2020·0 cites·15 claims
- 1241US2020388488A1Bottom-up curing of dielectric films in integrated circuitsIBM·Filed 2019·Application pending·0 cites
- 1341US2020388531A1Ion implantation assisted curing for flowable porous dielectricsIBM·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →