Inventor · disambiguated record
Yasutoshi Suzuki
Also filed as: SUZUKI YASUTOSHI · TOYODA INAO
84 granted patents·6 pending applications·5,105 citations·filing 1982–2014
99Inventor score
Top patents by PatentIndex Score
90 records- 0199US4721364ADazzle-free mirror with photocell in a non-dazzle-free portionNIPPON DENSO CO·Filed 1984·Granted Jan 26, 1988·367 cites·8 claims
- 0299US4697883AControl apparatus for two section, glare shield mirrorNIPPON DENSO CO·Filed 1985·Granted Oct 6, 1987·377 cites·7 claims
- 0399US4671615AControl apparatus for a dazzle-free reflection mirror of a vehicleNIPPON DENSO CO·Filed 1985·Granted Jun 9, 1987·361 cites·12 claims
- 0499US4669825AControl apparatus with delay circuit for antiglare mirrorNIPPON DENSO CO·Filed 1984·Granted Jun 2, 1987·258 cites·16 claims
- 0599US4632509AGlare-shielding type reflectorNIPPON DENSO CO·Filed 1984·Granted Dec 30, 1986·260 cites·6 claims
- 0699US4623222ALiquid crystal type dazzle-free transmissive-reflective mirrorNIPPON DENSO CO·Filed 1984·Granted Nov 18, 1986·547 cites·20 claims
- 0799US4499451AMirrorNIPPON DENSO CO·Filed 1982·Granted Feb 12, 1985·442 cites·6 claims
- 0898US6422088B1Sensor failure or abnormality detecting system incorporated in a physical or dynamic quantity detecting apparatusDENSO CORP·Filed 2000·Granted Jul 23, 2002·142 cites·64 claims
- 0998US4676601ADrive apparatus for a liquid crystal dazzle-free mirror arrangementNIPPON DENSO CO·Filed 1986·Granted Jun 30, 1987·285 cites·12 claims
- 1098US4669826AApparatus for detecting the direction of light for dazzle-free mirrorsNIPPON DENSO CO·Filed 1985·Granted Jun 2, 1987·202 cites·4 claims
- 1197US4669827ADetection of manipulation of position apparatus for dazzle-free mirrorNIPPON DENSO CO·Filed 1985·Granted Jun 2, 1987·141 cites·10 claims
- 1296US4655549AAutomatic antidazzle semitransparent mirrorNIPPON DENSO CO·Filed 1985·Granted Apr 7, 1987·144 cites·7 claims
- 1394US6744258B2Capacitive sensor apparatusDENSO CORP·Filed 2002·Granted Jun 1, 2004·63 cites·10 claims
- 1491US6199430B1Acceleration sensor with ring-shaped movable electrodeDENSO CORP·Filed 1999·Granted Mar 13, 2001·77 cites·48 claims
- 1590US6550339B1Pressure sensor for detecting differential pressure between two spacesDENSO CORP·Filed 2000·Granted Apr 22, 2003·59 cites·17 claims
- 1689US7197939B2Pressure sensorDENSO CORP·Filed 2005·Granted Apr 3, 2007·20 cites·13 claims
- 1789US6734671B2Magnetic sensor and manufacturing method thereforDENSO CORP·Filed 2002·Granted May 11, 2004·39 cites·14 claims
- 1889US6584852B2Electrical capacitance pressure sensor having electrode with fixed area and manufacturing method thereofDENSO CORPORTATION·Filed 2002·Granted Jul 1, 2003·49 cites·22 claims
- 1988US6595065B2Pressure detecting apparatus with metallic diaphragmDENSO CORP·Filed 2000·Granted Jul 22, 2003·36 cites·40 claims
- 2088US6388279B1Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereofDENSO CORP·Filed 1998·Granted May 14, 2002·70 cites·8 claims
- 2188US5244834ASemiconductor deviceNIPPON DENSO CO·Filed 1992·Granted Sep 14, 1993·88 cites·5 claims
- 2285US4687956ALiquid crystal element driving apparatusNIPPON DENSO CO·Filed 1984·Granted Aug 18, 1987·52 cites·12 claims
- 2384US5864064AAcceleration sensor having coaxially-arranged fixed electrode and movable electrodeNIPPON DENSO CO·Filed 1996·Granted Jan 26, 1999·59 cites·48 claims
- 2483US6640643B2Capacitive pressure sensor with multiple capacitive portionsDENSO CORP·Filed 2002·Granted Nov 4, 2003·27 cites·9 claims
- 2583US6521966B1Semiconductor strain sensorDENSO CORP·Filed 2000·Granted Feb 18, 2003·37 cites·10 claims
- 2683US6495389B2Method for manufacturing semiconductor pressure sensor having reference pressure chamberDENSO CORP·Filed 2001·Granted Dec 17, 2002·32 cites·7 claims
- 2783US5761957ASemiconductor pressure sensor that suppresses non-linear temperature characteristicsDENSO CORP·Filed 1997·Granted Jun 9, 1998·53 cites·5 claims
- 2881US7157054B2Membrane type gas sensor and method for manufacturing membrane type gas sensorDENSO CORP·Filed 2002·Granted Jan 2, 2007·18 cites·14 claims
- 2979US5701833AMethod and apparatus for sewing cloth pieces in a series to continuous slide fastener chainYKK CORP·Filed 1996·Granted Dec 30, 1997·15 cites·7 claims
- 3078US6653702B2Semiconductor pressure sensor having strain gauge and circuit portion on semiconductor substrateDENSO CORP·Filed 2001·Granted Nov 25, 2003·24 cites·2 claims
- 3177US7329975B2Ultrasonic sensorDENSO CORP·Filed 2006·Granted Feb 12, 2008·10 cites·9 claims
- 3277US5998234AMethod of producing semiconductor device by dicingDENSO CORP·Filed 1997·Granted Dec 7, 1999·59 cites·32 claims
- 3376US6169316B1Semiconductor pressure sensor including sensor chip fixed to package by adhesiveDENSO CORP·Filed 1999·Granted Jan 2, 2001·34 cites·18 claims
- 3476US5986316ASemiconductor type physical quantity sensorDENSO CORP·Filed 1997·Granted Nov 16, 1999·49 cites·31 claims
- 3576US5551586AMethod for manufacturing an electromagnetic conversion device and a displacement detector which uses an electromagnetic conversion deviceNIPPON DENSO CO·Filed 1994·Granted Sep 3, 1996·28 cites·14 claims
- 3675US7525237B2Ultrasonic sensorDENSO CORP·Filed 2007·Granted Apr 28, 2009·8 cites·11 claims
- 3775US6925885B2Pressure sensorDENSO CORP·Filed 2002·Granted Aug 9, 2005·21 cites·13 claims
- 3873US6578426B2Pressure sensor having semiconductor sensor chipDENSO CORP·Filed 2001·Granted Jun 17, 2003·17 cites·5 claims
- 3973US5949118AEtching method for silicon substrates and semiconductor sensorNIPPON DENSO CO·Filed 1996·Granted Sep 7, 1999·30 cites·20 claims
- 4072US7504276B2Micro device having micro system structure and method for method for manufacturing the sameDENSO CORP·Filed 2005·Granted Mar 17, 2009·6 cites·12 claims
- 4172US6802222B2Diaphragm-type semiconductor device and method for manufacturing diaphragm-type semiconductor deviceDENSO CORP·Filed 2002·Granted Oct 12, 2004·16 cites·15 claims
- 4272US6495814B1Photo sensor with signal processing circuitDENSO CORP·Filed 2000·Granted Dec 17, 2002·18 cites·19 claims
- 4371US6897669B2Semiconductor device having bonding pads and probe padsDENSO CORP·Filed 2003·Granted May 24, 2005·17 cites·6 claims
- 4471US6747329B2Semiconductor sensor chip having diaphragm and method of manufacturing the sameDENSO CORP·Filed 2001·Granted Jun 8, 2004·15 cites·4 claims
- 4571US5770883ASemiconductor sensor with a built-in amplification circuitNIPPON DENSO CO·Filed 1996·Granted Jun 23, 1998·31 cites·13 claims
- 4670US6870086B2Thermo pile infrared ray sensor manufactured with screen print and method thereofDENSO CORP·Filed 2002·Granted Mar 22, 2005·13 cites·6 claims
- 4769US6601452B2Semiconductor pressure sensor having rounded corner portion of diaphragmDENSO CORP·Filed 2001·Granted Aug 5, 2003·14 cites·10 claims
- 4868US6615668B2Semiconductor pressure sensor having signal processor circuitDENSO CORP·Filed 2001·Granted Sep 9, 2003·13 cites·10 claims
- 4968US6184561B1Semiconductor pressure sensor having strain gauges and stress balance filmDENSO CORP·Filed 1999·Granted Feb 6, 2001·25 cites·14 claims
- 5068US5619050ASemiconductor acceleration sensor with beam structureNIPPON DENSO CO·Filed 1995·Granted Apr 8, 1997·27 cites·11 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →