Inventor · disambiguated record
Yasuhiro Taguchi
Also filed as: TAGUCHI YASUHIRO
21 granted patents·3 pending applications·138 citations·filing 1987–2025
93Inventor score
Top patents by PatentIndex Score
24 records- 0194US8140194B2Supply-and-demand control system of distributed and coordinated type, for use in power systemsIINO YUTAKA·Filed 2010·Granted Mar 20, 2012·42 cites·17 claims
- 0292US8543248B2System for managing energy at loadsIINO YUTAKA·Filed 2010·Granted Sep 24, 2013·12 cites·9 claims
- 0382US10043721B2Method of manufacturing semiconductor device having semiconductor chip mounted on lead frameSII SEMICONDUCTOR CORP·Filed 2017·Granted Aug 7, 2018·3 cites·5 claims
- 0481US8612062B2Energy management system and energy management methodIINO YUTAKA·Filed 2010·Granted Dec 17, 2013·9 cites·15 claims
- 0577US10586773B2Semiconductor deviceABLIC INC·Filed 2018·Granted Mar 10, 2020·1 cites·19 claims
- 0676US6208208B1Operationally amplifying method and operational amplifierNEC CORP·Filed 1999·Granted Mar 27, 2001·36 cites·15 claims
- 0771US7582010B2Game machine, game program, and information storage mediumNINTENDO CO LTD·Filed 2003·Granted Sep 1, 2009·16 cites·36 claims
- 0869US9136208B2Semiconductor device and method of manufacturing the sameSEIKO INSTR INC·Filed 2014·Granted Sep 15, 2015·2 cites·12 claims
- 0960US2025303864A1Driving assistance apparatus and vehicleSUBARU CORP·Filed 2025·Application pending·0 cites
- 1049US11037866B2Semiconductor device and method of manufacturing the sameABLIC INC·Filed 2019·Granted Jun 15, 2021·0 cites·16 claims
- 1148US10804118B2Resin encapsulating mold and method of manufacturing semiconductor deviceABLIC INC·Filed 2018·Granted Oct 13, 2020·0 cites·7 claims
- 1248US9698064B2Semiconductor device having semiconductor chip mounted on lead frameSEIKO INSTR INC·Filed 2015·Granted Jul 4, 2017·0 cites·13 claims
- 1348US4918648AWord processing device capable of editing many distinct documents using a single selection processSHARP KK·Filed 1988·Granted Apr 17, 1990·7 cites·7 claims
- 1445US2015120077A1Energy management system, energy management method and computer-readable mediumTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1543US10850334B2Mold for resin sealing a semiconductor chip, and semiconductor device having resin-sealed semiconductor chipSEIKO INSTR INC·Filed 2015·Granted Dec 1, 2020·0 cites·2 claims
- 1642US10381245B2Manufacturing method for semiconductor deviceSII SEMICONDUCTOR CORP·Filed 2017·Granted Aug 13, 2019·0 cites·4 claims
- 1741US2020020617A1Resin encapsulating mold and manufacturing method for semiconductor deviceABLIC INC·Filed 2019·Application pending·0 cites
- 1840US10118400B2Liquid ejection systemSEIKO EPSON CORP·Filed 2016·Granted Nov 6, 2018·0 cites·10 claims
- 1938US10658275B2Resin-encapsulated semiconductor deviceSII SEMICONDUCTOR CORP·Filed 2017·Granted May 19, 2020·0 cites·6 claims
- 2037US10109561B2Semiconductor device having plated outer leads exposed from encapsulating resinSEIKO INSTR INC·Filed 2015·Granted Oct 23, 2018·0 cites·10 claims
- 2133US4959643ADisplay unit having an improved editing input capabilitySHARP KK·Filed 1988·Granted Sep 25, 1990·4 cites·6 claims
- 2228US5053988AData processing apparatusSHARP KK·Filed 1990·Granted Oct 1, 1991·0 cites·8 claims
- 2328US4931969ACharacter entry deviceSHARP KK·Filed 1989·Granted Jun 5, 1990·3 cites·11 claims
- 2428US4903233AWord processor having capability of continuously entering documents into a column or a block of an editing systemSHARP KK·Filed 1987·Granted Feb 20, 1990·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →