Inventor · disambiguated record
Yasuki Takata
Also filed as: TAKATA YASUKI
4 granted patents·3 pending applications·11 citations·filing 2001–2025
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0158US6518652B2Semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Feb 11, 2003·10 cites·6 claims
- 0251US2025285944A1Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2025·Application pending·0 cites
- 0349US9230937B2Semiconductor device and a manufacturing method thereofSUMITOMO KAORI·Filed 2012·Granted Jan 5, 2016·1 cites·13 claims
- 0441US7763966B2Resin molded semiconductor device and differential amplifier circuitRENESAS TECH CORP·Filed 2008·Granted Jul 27, 2010·0 cites·2 claims
- 0533US2005212103A1Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2005·Application pending·0 cites
- 0633US2004262723A1Semiconductor deviceRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 0728US8415245B2Method of manufacturing semiconductor device and semiconductor deviceTAKATA YASUKI·Filed 2010·Granted Apr 9, 2013·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Yasuki Takata files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →