Inventor · disambiguated record
Ya Chun Teng
Also filed as: TENG YA-CHUN
4 granted patents·2 pending applications·4 citations·filing 2017–2025
64Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
Top patents by PatentIndex Score
6 records- 0182US11189653B2Semiconductor device with buffer layer and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·1 cites·20 claims
- 0278US12205969B2Metal shielding structure to reduce crosstalk in a pixel arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 21, 2025·1 cites·20 claims
- 0373US12191334B2Semiconductor device with buffer layer and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 0472US2025142997A1Semiconductor device with buffer layer and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0572US2025113638A1Metal shielding structure to reduce crosstalk in a pixel arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0666US10515908B2Seal ring for bonded diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·2 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Ya Chun Teng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →