Inventor · disambiguated record
Yang Ti
Also filed as: TI YANG
2 granted patents·2 pending applications·0 citations·filing 2022–2025
24Inventor score
Files withHENKEL AG & CO KGAA4
Top patents by PatentIndex Score
4 records- 0164US2024240067A1Thermally conductive adhesive composition, preparation method and use thereofHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0260US12344739B2Conductive epoxy resin composition for copper bondingHENKEL AG & CO KGAA·Filed 2023·Granted Jul 1, 2025·0 cites·16 claims
- 0360US2025382514A1Curable adhesive composition comprising maleimide and thiolHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 0455US12051522B2Silver sintering composition containing copper alloy for metal bondingHENKEL AG & CO KGAA·Filed 2022·Granted Jul 30, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →