Inventor · disambiguated record
Yan-Zuo Tsai
Also filed as: TSAI YAN-ZUO
4 granted patents·20 pending applications·10 citations·filing 2005–2025
65Inventor score
Top patents by PatentIndex Score
24 records- 0192US10269611B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·10 cites·20 claims
- 0276US2025343162A1Warpage modulation through implantation and the structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0375US2025343164A1Semiconductor structure with stress relief layer and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US2025343186A1Bond features for reducing non-bond and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0575US2025336687A1Packages with implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US2025343165A1Packaged device with air gap and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US2025343123A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0870US2025210540A1Semiconductor structure with stress relief layer and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0970US2025062136A1Packages with ImplantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1069US2025062247A1Warpage Modulation Through Implantation and the Structures ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1169US2025062204A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1269US2025070045A1Packaged device with air gap and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1368US10867831B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 1467US2025006677A1Bond Features For Reducing Non-Bond and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1559US10748803B2Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 1659US2025239564A1Treatment process for wafer bonding processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025191941A1Method and apparatus for bonding semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1858US2025277752A1Optical inspection system, method of optical inspection, and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1956US2025149497A1Bonding tool and chip-on-wafer bonding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2055US11948920B2Semiconductor device and method for manufacturing the same, and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 2154US2024321694A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2253US2024274461A1Bonding tool for providing chip on wafer bond and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2353US2024170320A1Die bonding device, die bonding method and vacuum control method for pick-and-placer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2439US2006179887A1Mold for press-molding glass elementsNAT TSING HUA UNIVERISTY·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →