Inventor · disambiguated record
Ya-Wen Tseng
Also filed as: TSENG YA-WEN
7 granted patents·24 citations·filing 2009–2023
83Inventor score
Top patents by PatentIndex Score
7 records- 0193US10283496B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·10 cites·20 claims
- 0291US10679980B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 9, 2020·5 cites·20 claims
- 0389US11309307B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 0487US10388645B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 20, 2019·3 cites·20 claims
- 0584US12183729B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0678US11776948B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 0764US8704375B2Barrier structures and methods for through substrate viasLIU MAX·Filed 2009·Granted Apr 22, 2014·4 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →