Inventor · disambiguated record
Ya-Hsin Tseng
Also filed as: TSENG YA-HSIN
1 granted patent·3 pending applications·0 citations·filing 2003–2019
10Inventor score
Top patents by PatentIndex Score
4 records- 0143US10967480B2Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 0239US2015343567A1Method and system for formation of vertical microvias in opaque ceramic thin-plate by femtosecond laser pulseNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 0331US2004082174A1Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding padFiled 2003·Application pending·0 cites
- 0430US2004082159A1Fabrication method for solder bump pattern of rear section wafer packageFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →