Inventor · disambiguated record
Yasutsugu Tsutsumi
Also filed as: TSUTSUMI YASUTSUGU
12 granted patents·365 citations·filing 1988–1996
92Inventor score
Files withMITSUBISHI ELECTRIC CORP12
Top patents by PatentIndex Score
12 records- 0196US5059379AMethod of resin sealing semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 22, 1991·208 cites·2 claims
- 0277US5074779AMold for resin-sealing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 24, 1991·40 cites·5 claims
- 0363US4915608ADevice for resin sealing semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Apr 10, 1990·12 cites·9 claims
- 0461US5108278AResin sealing apparatusMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Apr 28, 1992·23 cites·6 claims
- 0556US5366364APlastic molding apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Nov 22, 1994·23 cites·8 claims
- 0652US5336272AMethod for molding a semiconductor package on a continuous leadframeMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 9, 1994·22 cites·4 claims
- 0743US5375989AApparatus for plastic encapsulation of a semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Dec 27, 1994·9 cites·3 claims
- 0840US5281121AResin sealing apparatusMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jan 25, 1994·9 cites·7 claims
- 0936US6224810B1Method of plastic moldingMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 1, 2001·5 cites·12 claims
- 1035US5662848APlastic molding method for semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 2, 1997·6 cites·13 claims
- 1135US4983111ADevice for resin sealing semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 8, 1991·3 cites·3 claims
- 1232US5134458ALong size lead frame for semiconductor elementsMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jul 28, 1992·5 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →