Inventor · disambiguated record
Yasufumi Uchida
Also filed as: UCHIDA YASUFUMI
17 granted patents·1 pending application·389 citations·filing 1996–2010
95Inventor score
Top patents by PatentIndex Score
18 records- 0194US6787915B2Rearrangement sheet, semiconductor device and method of manufacturing thereofOKI ELECTRIC IND CO LTD·Filed 2001·Granted Sep 7, 2004·81 cites·30 claims
- 0293US6690089B2Semiconductor device having multi-chip packageOKI ELECTRIC IND CO LTD·Filed 2002·Granted Feb 10, 2004·76 cites·28 claims
- 0383US5864174ASemiconductor device having a die pad structure for preventing cracks in a molding resinOKI ELECTRIC IND CO LTD·Filed 1996·Granted Jan 26, 1999·53 cites·6 claims
- 0481US6177725B1Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jan 23, 2001·48 cites·13 claims
- 0576US6620649B2Method for selectively providing adhesive on a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Sep 16, 2003·36 cites·16 claims
- 0674US6569755B2Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted May 27, 2003·16 cites·3 claims
- 0772US6576997B2Semiconductor device and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted Jun 10, 2003·14 cites·11 claims
- 0871US8288715B2Oxygen detection method, air leakage determination method, gas component detection device, and vacuum processing apparatusNAKAJIMA TOYOAKI·Filed 2010·Granted Oct 16, 2012·3 cites·11 claims
- 0971US6459145B1Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductorOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 1, 2002·13 cites·16 claims
- 1071US6437446B1Semiconductor device having first and second chipsOKI ELECTRIC IND CO LTD·Filed 2000·Granted Aug 20, 2002·14 cites·20 claims
- 1169US6686223B2Method for fabricating multi-chip package semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Feb 3, 2004·12 cites·1 claims
- 1263US6812556B2Multi-chip package semiconductor device having plural level interconnectionsOKI ELECTRIC IND CO LTD·Filed 2003·Granted Nov 2, 2004·11 cites·12 claims
- 1354US6614112B2Semiconductor device with shock absorbing bond padOKI ELECTRIC IND CO LTD·Filed 2002·Granted Sep 2, 2003·6 cites·34 claims
- 1452US2009031563A1Rearrangement sheet, semiconductor device and method of manufacturing thereofUCHIDA YASUFUMI·Filed 2008·Application pending·0 cites
- 1548US7435626B2Rearrangement sheet, semiconductor device and method of manufacturing thereofOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 14, 2008·2 cites·20 claims
- 1646US8044518B2Junction member comprising junction pads arranged in matrix and multichip package using sameOKI SEMICONDUCTOR CO LTD·Filed 2004·Granted Oct 25, 2011·2 cites·22 claims
- 1737US7317244B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 8, 2008·0 cites·29 claims
- 1831US6137166ASemiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Oct 24, 2000·2 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →