Inventor · disambiguated record
Yaqin Wang
Also filed as: WANG YAQIN
4 granted patents·9 pending applications·4 citations·filing 2013–2024
61Inventor score
Files withJCET MAN CO LTD3JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD3JIANGSU CHANGJIANG ELECTRONICS2SHARKNINJA OPERATING LLC2JCET SEMICONDUCTOR SUQIAN CO LTD1
Top patents by PatentIndex Score
13 records- 0190US12053141B2Vacuum cleaning device with foldable wand to provide storage configurationSHARKNINJA OPERATING LLC·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0274US2024415352A1Vacuum cleaning device with foldable wand to provide storage configurationSHARKNINJA OPERATING LLC·Filed 2024·Application pending·0 cites
- 0353US2025006685A1Semiconductor packages with multiple types of conductive componentsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0453US2025006585A1Semiconductor packages with multiple types of conductive componentsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0553US2025006682A1Semiconductor packages with multiple types of solder ballsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0651US9627303B2Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological methodJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted Apr 18, 2017·1 cites·20 claims
- 0750US9640413B2Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted May 2, 2017·1 cites·19 claims
- 0848US2024351859A1Connection line structure and forming method thereofWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Application pending·0 cites
- 0947US2013209969A1Kit and a Method For Visualizing a Whitening Benefit of a Cosmetic CompositionPROCTER & GAMBLE·Filed 2013·Application pending·0 cites
- 1045US2023411252A1Manufacturing method of semiconductor packaging member, semiconductor packaging member and mounting method thereofJCET SEMICONDUCTOR SUQIAN CO LTD·Filed 2023·Application pending·0 cites
- 1133US9633985B2First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2014·Granted Apr 25, 2017·0 cites·10 claims
- 1233US2016141233A1First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Application pending·0 cites
- 1333US2016163622A1Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →