Inventor · disambiguated record
Yam Mo Wong
Also filed as: WONG YAM MO
21 granted patents·286 citations·filing 1999–2015
95Inventor score
Top patents by PatentIndex Score
21 records- 0195US7780064B2Wire bonding method for forming low-loop profilesASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Aug 24, 2010·105 cites·10 claims
- 0289US7568606B2Electronic device handler for a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2006·Granted Aug 4, 2009·19 cites·15 claims
- 0386US7677431B2Electronic device handler for a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Mar 16, 2010·14 cites·5 claims
- 0485US7628307B2Apparatus for delivering shielding gas during wire bondingASM TECH SINGAPORE PTE LTD·Filed 2006·Granted Dec 8, 2009·13 cites·17 claims
- 0576US7954689B2Vacuum wire tensioner for wire bonderASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Jun 7, 2011·7 cites·19 claims
- 0672US6866182B2Apparatus and method to prevent oxidation of electronic devicesASM TECH SINGAPORE PTE LTD·Filed 2002·Granted Mar 15, 2005·21 cites·11 claims
- 0766US6749100B2Multiple-head wire-bonding systemASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jun 15, 2004·15 cites·22 claims
- 0865US8919631B2Wire bonder including a transducer, a bond head, and a mounting apparatusWONG YAM MO·Filed 2012·Granted Dec 30, 2014·3 cites·17 claims
- 0963US7025243B2Bondhead for wire bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2004·Granted Apr 11, 2006·11 cites·18 claims
- 1062US7214606B2Method of fabricating a wire bond with multiple stitch bondsASM TECH SINGAPORE PTE LTD·Filed 2004·Granted May 8, 2007·13 cites·15 claims
- 1162US7100812B2Capillary holderASM TECH SINGAPORE PTE LTD·Filed 2005·Granted Sep 5, 2006·3 cites·12 claims
- 1259US7064433B2Multiple-ball wire bondsASM TECH SINGAPORE PTE LTD·Filed 2004·Granted Jun 20, 2006·12 cites·12 claims
- 1357US6827247B1Apparatus for detecting the oscillation amplitude of an oscillating objectASM TECH SINGAPORE PTE LTD·Filed 1999·Granted Dec 7, 2004·26 cites·27 claims
- 1456US7997470B2Flanged transducer having improved rigidityASM TECH SINGAPORE PTE LTD·Filed 2006·Granted Aug 16, 2011·1 cites·5 claims
- 1554US6672503B2Method of bonding wiresASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jan 6, 2004·10 cites·15 claims
- 1654US6572001B2Bonding systemASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jun 3, 2003·6 cites·10 claims
- 1746US7494042B2Method of forming low wire loops and wire loops formed using the methodASM TECH SINGAPORE PTE LTD·Filed 2003·Granted Feb 24, 2009·2 cites·9 claims
- 1845US9989587B2Apparatus for testing multiple semiconductor dice with increased throughputASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Jun 5, 2018·0 cites·17 claims
- 1944US7314157B2Wire bond with improved shear strengthASM TECH SINGAPORE PTE LTD·Filed 2004·Granted Jan 1, 2008·1 cites·14 claims
- 2036US6660956B1Method of and apparatus for monitoring a ball forming processASM TECHNOLOGY SINGAPORE PTE·Filed 2000·Granted Dec 9, 2003·3 cites·10 claims
- 2134US7303109B2Stud bumping apparatusASM TECH SINGAPORE PTE LTD·Filed 2003·Granted Dec 4, 2007·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →