Inventor · disambiguated record
Ya-Tzu Wu
Also filed as: WU YA-TZU
0 granted patents·4 pending applications·0 citations·filing 2007–2014
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0146US2016005674A1Integrated circuit assembly and integrated circuit packaging structureRICHTEK TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 0241US2009212428A1Re-distribution conductive line structure and the method of forming the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 0340US2008197469A1Multi-chips package with reduced structure and method for forming the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 0416US2012273931A1Integrated circuit chip package and manufacturing method thereofYANG HSI-CHEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →